Dow Corning® TC-4525 Thermally Conductive Gap Filler Offers Highly Processable, Heat Management in Automotive Electronics

Published May 12, 2015

MIDLAND, Mich.– Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced Dow Corning® TC-4525 Thermally Conductive Gap Filler to meet fast-growing global demand for improved processability and thermal management in automotive electronics applications. The latest addition to Dow Corning’s broad and growing portfolio of heat management solutions, this high-performing new silicone technology delivers thermal conductivity of 2.5W/m.K, greatly improved dispensability, significantly reduced abrasiveness and stable performance for more reliable electronics in harsh automotive underhood environments.