Dow Corning to Discuss How Two Innovative Silicone Adhesives Benefit Advanced Assembly at IPC APEX EXPO 2017

Published Feb 08, 2017

Brian Chislea, application engineer for Dow Corning, is presenting a poster at IPC APEX EXPO 2017 in San Diego, Calif., that highlights how two new classes of advanced silicone adhesives are expanding design flexibility for advanced assembly solutions. Titled “New Silicone Adhesives for Advanced Assembly Solutions,” his presentation is scheduled for Wednesday, Feb. 15, 2017 from 10:00 to 10:30 a.m. and again from 4:30 to 5:00 p.m. during the conference’s Design Track.