SABIC introduces new THERMOCOMP™ HMD-D series of high modulus ductile compounds to the Americas, Europe at NPE 2018

Published May 11, 2018

SABIC, a global leader in the chemical industry, is introducing its next-generation THERMOCOMP™ HMD-D compounds to the Americas and Europe here at NPE 2018. Initially launched in Asia, these materials, on display at the company’s booth (S19001), expand SABIC’s THERMOCOMP portfolio of specialty compounds with high-performance, glass-reinforced polycarbonate (PC) materials. The new series of six grades delivers a unique combination of high modulus and ductility to enable lighter, thinner and stronger parts that advance design innovation and ease of use. They are engineered for challenging structural components in the consumer electronics, healthcare and transportation sectors.