Solvay expands offering of high-performance polymers for 3D-printing simulation

Published Jan 30, 2019

Solvay adds 10% carbon fiber filled KetaSpire® polyetheretherketone (PEEK) and neat Radel® polyphenylsulfone (PPSU) to e-Xstream engineering’s latest release (2019.0) of Digimat®-Additive Manufacturing (AM) software.These products complement the neat KetaSpire® PEEK AM filament already available for simulation on e-Xstream engineering’s Digimat®-AM platform.