Dow Corning Appoints Tang-Yong Ang as New Vice President To Lead Company’s Growing Compound Semiconductor Business

Published Oct 23, 2013

Midland, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, today announced the appointment of Tang Yong Ang “TY.” to vice president of Dow Corning’s Compound Semiconductor Solutions, a leading provider of high-quality silicon carbide (SiC) wafer and epitaxy product lines to the global power electronics industry. In this critical, newly created role, effective October 1, TY will lead the company’s expanding Compound Semiconductor Solutions business, and report to the general manager of the Specialty Chemicals business. This signals a major strategic step for Dow Corning, and highlights the company’s increased focus and support for the exciting and promising SiC power electronics market.