Dow Corning Takes Prestigious 3D InCites Award for Its Advanced New Temporary Bonding Solution for 2.5D and 3D IC Innovation

Published Jul 17, 2013

MIDLAND, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week’s SEMICON West 2013 in San Francisco.