DOW CORNING JOINS EV GROUP’S OPEN PLATFORM FOR TEMPORARY BONDING MATERIALS FOR 3D IC MANUFACTURING

Published Sep 03, 2013

St. Florian, Austria and TAIPEI, Taiwan, Sept. 3, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG’s LowTemp™ platform for room-temperature wafer bonding and debonding processes. The addition of Dow Corning – a global leader in silicones, silicon-based technology and innovation – to EVG’s industry-leading list of collaboration partners follows intensive co-development efforts between the two companies, including stringent testing of Dow Corning’s simple and innovative bi-layer temporary bonding technology. EVG launched its new open LowTemp platform in July when it also announced the expansion of its global materials supply chain to accelerate the growth of high-end 3D IC packaging. The company is exhibiting its technology at SEMICON Taiwan (Booth #416), from September 4 to 6 in Taipei, Taiwan.