Dow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging

Published Jul 08, 2013

SAN FRANCISCO – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.