Dow Corning and SÜSS MicroTec Report New Temporary Bonding Solution for 2.5D and 3D IC Packaging at ECTC 2013

Published May 29, 2013

LAS VEGAS, Nev.– The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processing session, when Ranjith John, materials development & integration engineer at Dow Corning, presented a paper co-authored by Dow Corning, a global leader in silicones, silicon-based technology and innovation, and SÜSS MicroTec, a leading supplier of semiconductor processing equipment.