Dow Corning Launches High-Performance Thermally Conductive Adhesives for Tough Automotive Electronics Applications at Bondexpo

Published Oct 07, 2013

STUTTGART, Germany – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today at Bondexpo two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. The new silicone technologies include Dow Corning® TC-2030 Thermally Conductive Adhesive, the company’s most advanced solution for traditional automotive electronics applications, and Dow Corning® TC-2035 Thermally Conductive Adhesive, a high-performance thermal interface material for high-heat automotive applications, such as next-generation power electronic modules. Both materials as well as other products from Dow Corning’s expansive portfolio of thermal management solutions are being featured here at the company’s stand (7518, hall 7).