Dow Corning Expands Thermal Management Options with Two Grades Offering Optimized Rheology for Electronics Applications

Published Jun 11, 2013

LAS VEGAS, Nev.– As electronics designers and manufacturers continue to move toward smaller, faster and higher performing devices, the challenge of thermal management is steadily mounting. Less board space and increased operating frequencies are raising temperatures, and risking reduced device performance and reliability over time. To help electronics designers and manufacturers address these thermal challenges, Dow Corning is introducing here at the Electronic Components and Technology Conference 2013 (ECTC) two advanced new grades to its proven line of Thermal Interface Materials (TIMs): Dow Corning® TC-5622 and TC-5351 Thermally Conductive Compounds.