New Dow Corning Dispensable Thermal Pads Offer Streamlined Manufacture and Increased Thermal Performance for Electronics

Published Dec 02, 2013

MIDLAND, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced new Dow Corning® Dispensable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electronics targeting LED lamp and luminaires, data servers, telecommunications equipment and transportation applications. The new materials enable manufacturers to quickly and precisely print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex-shaped substrates while ensuring excellent thermal management properties and reduced manufacturing cost.