Dow Corning Expands Prime Grade Portfolio Setting New Industry Standard for 150mm SiC Wafer Crystal Quality

Published Sep 18, 2014

Midland, Mich. – Dow Corning, a global leader in silicon and wide-bandgap semiconductor technology, raised the bar yet again for silicon carbide (SiC) crystal quality today by announcing that it now offers 150 mm diameter silicon carbide (SiC) wafers under its ground-breaking Prime Grade portfolio. Recently launched to set new standards for 100 mm SiC wafer quality, the portfolio now also offers three tiers of manufacturing quality 150 mm SiC substrates – labeled Prime Standard, Prime Select and Prime Ultra. Each tier offers increasingly stringent tolerances on critical defect types that adversely impact device performance, such as micropipe density (MPD), threading screw dislocations (TSD) and basal plane dislocations (BPD).