New Low-Stress Silicone Encapsulant Expands Dow Corning’s Portfolio of Reliability-Enhancing Solutions for Solar Inverters

Published May 13, 2014

Midland, Mich. – As the total cost of non-active materials in solar systems outstrips that of photovoltaic (PV) modules, solar manufacturers are seeking new, high-performing materials able to drive down balance-of-system costs while increasing the efficiency and durability of their products. Against this competitive backdrop, Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced Dow Corning® EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its broad and growing portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components.