Dow Corning
Electronics

2013年6月13日- 中国广州：道康宁，作为全球领先的有机硅、硅技术与创新企业将在第18届广州国际照明展览会 (展馆3.2， 展位号：D36) 期间，重点展示其行业领先的苯基硅光学灌封胶系列的5款新增产品。这五款全新双组分、热固化产品的可靠性得到进一步提升，并拥有更好的银电极防腐蚀功能，以及更好的针对日益严苛LED产品设计标准的耐久性。它们也进一步验证了道康宁致力于推动LED技术在重要增长领域，如中国快速增长的通用照明市场取得最佳进展和更广泛应用的承诺。 View more and related images

2013年6月13- 中国广州：据麦肯锡咨询公司报告称，去年，中国占亚洲照明市场的45%，而中国照明市场的12%则来自LED照明。据麦肯锡公司预测，从现在起到2016年，中国LED通用照明市场的复合年均增长率将达43%。全球领先的有机硅、硅技术与创新企业道康宁则预计，更多先进材料技术的应用是推动这种增长的一大因素。传统的LED材料促进了低功率照明市场的增长，而高性能产品如有机硅材料则帮助固态照明产品应对中国快速发展的通用照明市场日益严苛的要求。 View more and related images

Guangzhou, China – Increases in LED power and output over the past decade have fueled adoption first in mobile device displays, then in flat panel televisions and now in general lighting applications. Asia currently leads the market transition to LEDs for general lighting, driven especially by swift penetration in China, according to analyst firm McKinsey & Company, which projects China’s compound annual growth rate for LED-based general lighting to be 43 percent through 2016. Dow Corning – a global innovator in silicones and silicon-based technology – expects a key factor in this growth will be adoption in China of high refractive index (RI) materials, such as phenyl-based optical silicones that can significantly boost light output without costly investment in more powerful LED dies. View more and related images

LAS VEGAS, Nev.– As electronics designers and manufacturers continue to move toward smaller, faster and higher performing devices, the challenge of thermal management is steadily mounting. Less board space and increased operating frequencies are raising temperatures, and risking reduced device performance and reliability over time. To help electronics designers and manufacturers address these thermal challenges, Dow Corning is introducing here at the Electronic Components and Technology Conference 2013 (ECTC) two advanced new grades to its proven line of Thermal Interface Materials (TIMs): Dow Corning® TC-5622 and TC-5351 Thermally Conductive Compounds. View more and related images

LAS VEGAS, Nev.– The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at the 2013Electronic Components & Technology Conference (ECTC), with the report of an advanced new temporary bonding solution for 3D Through-Silicone-Via (TSV) semiconductor packaging. The breakthrough was unveiled during ECTC’s 3D Materials and Processing session, when Ranjith John, materials development & integration engineer at Dow Corning, presented a paper co-authored by Dow Corning, a global leader in silicones, silicon-based technology and innovation, and SÜSS MicroTec, a leading supplier of semiconductor processing equipment. View more and related images

Philadelphia – Dow Corning, a global leader in silicones, silicon-based technology and innovation is showcasing at LIGHTFAIR®International 2013 (booth #159) how LED designers and manufacturers can capitalize on the unique benefits that advanced silicone materials offer the fast-growing LED lighting industry. On display at the company’s booth, LED applications and live demonstrations are spotlighting how high-performance silicones contribute to improved efficiencies, greater design freedom and enhanced productivity. View more and related images

Philadelphia – Dow Corning, a global leader in silicones, silicon-based technology and innovation, introduced at LIGHTFAIR® International 2013 (booth #159) its new Dow Corning® Dispensable Thermal Pads, an innovative technology developed for more cost-effective thermal management in LED lighting applications. The new materials now enable LED lamp and luminaire manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes while ensuring excellent thermal management properties and reduced manufacturing cost. View more and related images

日期：2013年3月20日- 美国密歇根州米德兰市——全球领先的有机硅、硅基技术与创新企业道康宁公司向医疗保健行业推出道康宁®QP1系列液体硅橡胶(LSR)，为精密医疗器械及部件的生产制造提供更为丰富的材料选择。该系列包括八款半透明有机硅弹性体，专为短期、非植入及插入式用途而研发，有各种硬度可供选择，同时具有一系列包括高撕裂强度在内的高性能与多项加工优势，从而可缩短加工周期。该系列材料与其它原材料结合配方后制成的产品符合美国食品和药物管理局 (FDA)的食品接触级标准，并通过美国药典(USP)VI级测试。 View more and related images

Midland, Mich.– Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it will introduce an innovative new thermal management silicone technology for light emitting diode (LED) lamps and luminaires at LIGHTFAIR® International (LFI) in booth #159. They will exhibit these materials as part of their growing family of industry-leading LED lighting solutions. The company will conduct live demonstrations at its booth to spotlight how silicones can increase efficiency, expand LED design options and provide greatly improved processability, underscoring how these products are fast becoming the materials of choice in critical lamp and luminaire applications. View more and related images

San Francisco– Today at the Photonics West conference, Dow Corning and IBM scientists unveiled a major step in photonics, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers. This new silicone-based material offers better physical properties, including robustness and flexibility, making it ideal for applications in Big Data and for the development of future exascale computers, which are capable of performing a billion billion computations per second. View more and related images