Dow Corning
Electronics

MUNICH, Germany– Dow Corning, a global leader in silicones, silicon-based technology and innovation arrives here at Strategies in Light 2013 with an active program showcasing the breakthrough potential that its award-winning moldable silicones technology offers today’s LED lamp and luminaire designs. In addition to delivering a key presentation titled How Silicone Enables the Next Generation of Secondary Optics for LED Lighting, Dow Corningwill feature its high-performance portfolio of industry-leading optical moldable silicones at Booth B25. Most notably, the company is launching at Strategies in Light its newest addition to the Moldable Silicones family: Dow Corning® MS-2002 Moldable White Reflector Silicone, which targets reflectivity as high as 98 percent to help further boost light output from LED devices, improve overall energy efficiency and prolong device reliability. View more and related images

Midland, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, today announced the appointment of Tang Yong Ang “TY.” to vice president of Dow Corning’s Compound Semiconductor Solutions, a leading provider of high-quality silicon carbide (SiC) wafer and epitaxy product lines to the global power electronics industry. In this critical, newly created role, effective October 1, TY will lead the company’s expanding Compound Semiconductor Solutions business, and report to the general manager of the Specialty Chemicals business. This signals a major strategic step for Dow Corning, and highlights the company’s increased focus and support for the exciting and promising SiC power electronics market. View more and related images

STUTTGART, Germany – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today at Bondexpo two new thermally conductive adhesives developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. The new silicone technologies include Dow Corning® TC-2030 Thermally Conductive Adhesive, the company’s most advanced solution for traditional automotive electronics applications, and Dow Corning® TC-2035 Thermally Conductive Adhesive, a high-performance thermal interface material for high-heat automotive applications, such as next-generation power electronic modules. Both materials as well as other products from Dow Corning’s expansive portfolio of thermal management solutions are being featured here at the company’s stand (7518, hall 7). View more and related images

SEOUL, South Korea – Signaling the end of a patent battle lasting for almost three years, Korea’s Intellectual Property Tribunal (IPT) rejected an attempt to invalidate Dow Corning’s patent 10-976075. The patent is among Dow Corning’s rich intellectual property (IP) portfolio covering the company’s proprietary high refractive index (RI) phenyl-based optical silicone technology, which offers numerous high-value benefits to LED devices. These benefits include improved light output, excellent mechanical protection of LED components and enduring gas barrier properties for enhanced reliability. Handed down by the IPT on August 9, the decision in favor of Dow Corning significantly strengthens its intellectual property position for the technology in Korea, as well as in other key global LED manufacturing centers, including the U.S., Japan, Taiwan, China, Malaysia and Europe. View more and related images

St. Florian, Austria and TAIPEI, Taiwan, Sept. 3, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG’s LowTemp™ platform for room-temperature wafer bonding and debonding processes. The addition of Dow Corning – a global leader in silicones, silicon-based technology and innovation – to EVG’s industry-leading list of collaboration partners follows intensive co-development efforts between the two companies, including stringent testing of Dow Corning’s simple and innovative bi-layer temporary bonding technology. EVG launched its new open LowTemp platform in July when it also announced the expansion of its global materials supply chain to accelerate the growth of high-end 3D IC packaging. The company is exhibiting its technology at SEMICON Taiwan (Booth #416), from September 4 to 6 in Taipei, Taiwan. View more and related images

MIDLAND, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week’s SEMICON West 2013 in San Francisco. View more and related images

MIDLAND, Mich. – Semiconductor sales appear to be finally emerging from the red this year, with moderate but steady growth of 5.1 percent projected through 2014, according to World Semiconductor Trade Statistics’ Spring 2013 global semiconductor sales forecast. While a revival in end-market demand is sparking much of this growth, Dow Corning, a global leader in silicones, silicon-based technology and innovation, sees collaborative advances in materials and processing technologies as a sustaining force in the industry’s recovery. View more and related images

SAN FRANCISCO – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures. View more and related images

2013年6月17日- 美国密歇根州米德兰市——随着设计师和厂商越来越倾向于设计和生产外形更小、速度更快、性能更高的电子设备，随之而产生的热管理的难度也不断上升。设备空间的不断减小和操作频率的不断增加使设备的温度也不断上升，并有可能对设备性能与可靠性造成影响。为帮助电子产品设计师和制造商克服上述难题，道康宁在其成熟的导热界面材料（TIMs）产品线基础上推出两款全新产品：道康宁® TC-5622与TC-5351导热材料。 View more and related images

2013年6月14- 中国广州：全球领先的有机硅、硅基技术与创新企业道康宁今日向亚洲市场隆重推出全新的道康宁® 可印刷/点胶式导热硅胶垫片材料，这一创新技术专为LED照明用途实现更具成本效益的热量管理而开发。其新型的有机硅材料有助于LED灯具及照明制造商更迅速、精确地在形状复杂的基材上印刷或点胶厚度可控的导热有机硅，同时确保优良的导热性能、减少浪费从而降低生产成本。道康宁这款全新可印刷/点胶式导热垫片材料将作为全球新品发布计划的一部分亮相第18届广州国际照明展览会（3.2号展馆，D36号展位），以展示道康宁在全球照明行业的技术领先地位。 View more and related images