St. Florian, Austria and TAIPEI, Taiwan, Sept. 3, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG’s LowTemp™ platform for room-temperature wafer bonding and debonding processes. The addition of Dow Corning – a global leader in silicones, silicon-based technology and innovation – to EVG’s industry-leading list of collaboration partners follows intensive co-development efforts between the two companies, including stringent testing of Dow Corning’s simple and innovative bi-layer temporary bonding technology. EVG launched its new open LowTemp platform in July when it also announced the expansion of its global materials supply chain to accelerate the growth of high-end 3D IC packaging. The company is exhibiting its technology at SEMICON Taiwan (Booth #416), from September 4 to 6 in Taipei, Taiwan. View more and related images
Press Releases
BOSTON –Ten companies and their partners will receive awards at the second annual JEC Americas Composites Show and Conferences at the Boston Convention and Exhibition Center, October 2 – 4, 2013. The latest crop of winners will be recognized at an Awards ceremony on Wednesday, October 2 at 3:00 p.m. on the exhibition floor of the JEC Americas exhibition. The Event is be open to all visitors, and will be hosted by Gene Lavanchy, one of the Boston’s most recognizable news anchors. View more and related images
CHICAGO – PolyOne GLS Thermoplastic Elastomers, a global leader in high-performance, custom-formulated thermoplastic elastomer (TPE) solutions, today unveiled Versaflex™ CE thermoplastic elastomers. Created for applications in the consumer electronics market, this family of TPEs enables consumer electronics companies to differentiate their devices through design, performance and market-driven aesthetics. View more and related images
Dallas – Aug. 21, 2013 – Nypro Healthcare, A Jabil Company, today announced the opening of a new Design and New Product Introduction Center (NPI) in Dallas, Texas. The new NPI Center will furnish full product design services and development for single-use and electro-mechanical Class I, II and III medical devices. The 32,000 sq. ft. facility features an advanced technology model shop, a fully-digitized machine shop, environmentally controlled chambers and a 1,500 sq. ft. Class 10,000 Clean Room. Nypro Healthcare’s new center is also conveniently located near major medical device manufacturing facilities located in Cayey, Puerto Rico and Tijuana, Mexico as well as the company’s large medical device customers. View more and related images
St. Petersburg, FL – August 21, 2013 – Jabil’s Chad Industries announces today that is has completed the first installation of its WaferMate200 with GPD Global’s MAX Series Dispense System. View more and related images
BOSTON – JEC, a world-renowned resource for composites industry services, support and expertise, today announced the long-awaited schedule for its Innovative Composites Summit (I.C.S.), a program of strategic, technical and end-user conferences. View more and related images
MIDLAND, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced that it has won a prestigious 3D InCites Award for its innovative new Temporary Bonding Solution for 2.5D and 3D IC packaging applications. Winning the Materials category, Dow Corning accepted the award at a well-attended, invitation-only ceremony held during last week’s SEMICON West 2013 in San Francisco. View more and related images
MIDLAND, Mich. – Semiconductor sales appear to be finally emerging from the red this year, with moderate but steady growth of 5.1 percent projected through 2014, according to World Semiconductor Trade Statistics’ Spring 2013 global semiconductor sales forecast. While a revival in end-market demand is sparking much of this growth, Dow Corning, a global leader in silicones, silicon-based technology and innovation, sees collaborative advances in materials and processing technologies as a sustaining force in the industry’s recovery. View more and related images
2013年7月8日，中国上海 —— 欧文斯科宁公司（纽约证交所交易代码：OC）日前宣布在中国市场推出新一代环保节能保温材料EcoTouch™玻璃棉，该产品标志着玻璃棉制造工艺的革命性突破 View more and related images
SAN FRANCISCO – Dow Corning, a global leader in silicones, silicon-based technology and innovation, announced today that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics. The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures. View more and related images