Press Releases

Midland, Mich. – The compound annual growth rate (CAGR) for the global chip-on-board (COB) LED market will be just over 40 percent through 2018, according to analyst firm Research and Markets. Dow Corning, a global leader in silicones, silicon-based technology and innovation, expects the continued expansion of enabling materials technologies, such as moldable optical silicones, to help fuel growth in COB packaging and other innovations along the entire LED lighting value chain. View more and related images

Danbury, Conn. (June 4, 2014) – Addivant™, a global leader in polymer additive technologies, today announced that WESTON® 705 liquid antioxidant, the next generation of nonylphenol-free phosphite technology, has received approval from the U.S. Food and Drug Administration (FDA) for food contact applications. Extensively researched and supported with comprehensive toxicology testing, WESTON®705 antioxidant provides superior safety as well as enhanced polymer performance and higher processing productivity vs. conventional solid phosphites. The product delivers major benefits across the entire value chain, from resin producers and converters to retailers and consumers. View more and related images

Las Vegas – Dow Corning, a global leader in silicones, silicon-based technology and innovation, is showcasing here at LIGHTFAIR® International 2014 (Booth #8425) its fast-growing portfolio of optical-grade silicones, which are helping LED lighting manufacturers worldwide to expand the possibilities for LED module, lamp and luminaire designs. In addition to the entire Dow Corning Moldable Silicones product family, the company is featuring two recently launched materials innovations and offering visitors an exclusive sneak peek at two additional advanced product technologies nearing commercialization. Many of the breakthrough applications that Dow Corning has helped to pioneer are also on display at its booth, along with live demonstrations that illustrate the design and process benefits of the company’s optical moldable materials. View more and related images

As a composite armor industry veteran, Leading Technology Composites (LTC) is no stranger to light weight ballistic armor solutions. It comes as no surprise that their latest innovations have yielded the industry’s lightest, most robust, armor systems, providing state-of-the-art performance at a significant weight reduction. View more and related images

Midland, Mich. – Dow Corning, a global leader in silicones, silicon-based technology and innovation, today announced that Dow Corning® CE-1874 Microemulsion won first place in the 3rd Annual Torch of Technology Showcase at New York Society of Cosmetic Chemists’ (NYSCC) Suppliers’ Day 2014 in Edison, N.J. The new leading-edge microemulsion – which received the vast majority of showcase competition votes – provides exceptional hair repair and protection benefits to shampoos without compromising hair volume. View more and related images

Danbury, Conn. (May 21, 2014) – Addivant™, a global polymer additives manufacturer, celebrated the opening of its new headquarters in Danbury, Conn., USA today with a ribbon-cutting ceremony and reception. The new facility, located at 4 Mountainview Terrace, caps off the company’s first 12 months as a standalone organization and demonstrates its strong commitment to growth. Addivant, previously a business unit of Chemtura in Middlebury, Conn., became an independent portfolio company of SK Capital on May 1, 2013. From its new headquarters, Addivant operates 11 plants on five continents and nine technology and application testing centers worldwide. View more and related images

BOLLATE, Italy May 21, 2014 – Solvay Specialty Polymers has announced the introduction of a new high stiffness grade of KetaSpire® polyetheretherketone (PEEK) that provides 50% greater modulus/stiffness than standard neat PEEK grades. Despite its higher stiffness, the new grade, KetaSpire® KT-825, retains the elongation and toughness that is comparable to that of neat PEEK resin for structural applications in transportation, electronics, semiconductor, and oil and gas. View more and related images

Edison, N.J. – Dow Corning is featuring here at the New York Society of Cosmetic Chemists (NYSCC) Suppliers’ Day 2014 an exciting line-up of sophisticated formulation concepts and advanced silicone ingredients for hair care products to help customers stay ahead of the latest global trends. In booth #921, the company is spotlighting new Dow Corning® CE-1874 Microemulsion, which provides exceptional hair repair and protection benefits to shampoos without compromising hair volume. The company is also featuring the newest edition of its Trends Lab. Titled “Life without Boundaries,” this inspiring collection of new silicone-based formulation concepts highlights major trends that will drive tomorrow’s consumer demand for benefits-rich hair care products. View more and related images

Edison, N.J.– Dow Corning, a global leader in silicones, silicon-based technology and innovation, introduced here today at the New York Society of Cosmetic Chemists (NYSCC) Suppliers’ Day 2014 (booth #921), a unique array of high-performance silicone ingredients and trendsetting formulation concepts for skin care products.These includeDow Corning® ES-5600 Silicone Glycerol Emulsifier, Dow Corning® EP-9801 Hydro Cosmetic Powder, and next-generation formulations from Dow Corning’s new Aqua Dimensions program. Dow Corning is also launching “Life without Boundaries,” the newest edition of its Trends Lab program of silicone-based formulation concepts that help customers address emerging consumer skin care preferences. View more and related images

Midland, Mich. – As the total cost of non-active materials in solar systems outstrips that of photovoltaic (PV) modules, solar manufacturers are seeking new, high-performing materials able to drive down balance-of-system costs while increasing the efficiency and durability of their products. Against this competitive backdrop, Dow Corning, a global leader in silicones, silicon-based technology and innovation, today introduced Dow Corning® EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its broad and growing portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components. View more and related images